Stencil printing

Lynx stands out as a leader in advanced stencil printing solutions, setting new standards in precision, repeatability, and yield for silver and copper sintering applications.  
Through proprietary process development and optimized material handling, we have created printing concepts that ensure controlled paste deposition, perfect thickness uniformity, and flawless surface definition — even in power module for demanding applications.
This level of control translates directly into higher assembly yields, greater process stability, and superior joint quality, establishing their technology as a reference point in high-performance die attach and sintering assembly.

Sinter Foil / Paste die / spacer hot tack

Lynx PT specializes in both foil-based (Direct-to-Foil, DTF) and dried printed sinter media technologies for die and spacer hot tack applications prior to pressure-assisted sintering.
These approaches enable precise placement and bonding, ensuring optimal thermal and mechanical performance. DTF is particularly advantageous when stencil printing is not applicable, offering deep access and flexibility in complex or constrained geometries.

Ag/Cu pressure assisted sintering

Pressure-assisted sintering for silver (Ag) and copper (Cu) media stands out as one of the most mature and well-developed technologies at Lynx . Key process parameters—such as porosity, sintering media type (nano, micro, or hybrid), and bond line thickness—are carefully tailored to meet the reliability requirements and semiconductor type specified by the customer.
The pressure-assisted sintering process can be implemented using different technologies, including membrane-based systems and independent insert mechanisms, each offering unique advantages depending on the application and desired performance.

Clip soldering/welding

We have developed a wide range of clip bonding solutions, utilizing both soldered and sintered techniques. Clip bonding significantly enhances reliability and extends device lifespan—up to 10 times longer compared to conventional aluminum wire bonding.
The opposite end of the clip can be joined using various methods, including laser welding, ultrasonic welding, soldering, or sintering, depending on the application and performance requirements.

Thick copper wire bonding onto thick copper on die

Thick copper (Cu) wire bonding directly on die surfaces with thick copper layer is a proven interconnect solution for high-power modules, offering superior electrical and thermal performance. This approach enables robust mechanical anchoring and efficient current handling, even under demanding thermal and power cycling conditions.
Bonding thick copper wires directly to the die with thick copper layer enhances adhesion and reduces the risk of delamination or bond lift-off. When properly engineered, this method significantly improves reliability and extends module lifetime—often exceeding 10× the durability of conventional aluminum wire bonding. This technique is ideal for automotive, industrial, and renewable energy applications where long-term durability is critical.

Adhesion promoter

Our adhesion promoter technology plays a critical role in significantly reducing—or even eliminating—delamination of the molding compound in molded packages and power modules. This is especially important when these components are soldered or sintered onto PCBs and thermal management systems such as coolers.
Material selection is key to achieving optimal results. We work closely with customers to identify and implement the most suitable adhesion solution tailored to the specific requirements of each project, ensuring long-term reliability and mechanical integrity.

Foil assisted retractable pin molding

Our advanced thermoset transfer molding process integrates foil-assisted placement and retractable ejector pin technology to enable high-precision encapsulation of power modules and semiconductor packages.
Foil Assistance: The use of foil layers allows for clean separation between the mold surface and the molded compound, minimizing mechanical stress and surface defects. This is especially beneficial for sensitive die surfaces and complex geometries.
Retractable Ejector Pins: Strategically positioned retractable ejector pins ensure smooth demolding without damaging the package. Their controlled retraction during the molding cycle prevents voids and improves surface integrity and least flashes / bleed .
This combination enhances mold release performance, reduces delamination risk, and supports high-volume manufacturing with consistent quality. Material selection and mold design are critical to achieving optimal results, and we collaborate closely with customers to tailor solutions to their specific application needs.

Laser welding

We have developed advanced laser welding processes for both internal clip interconnections within power modules and external bus bar connections for high-current pathways. This clean and precise technology delivers highly reliable joints with minimal contamination or thermal damage.
The choice of laser type—whether green, infrared (IR), or ultra-fast laser (UFL)—is critical for optimizing energy concentration and controlling heat diffusion to neighboring components. Proper laser selection ensures strong metallurgical bonding while preserving the integrity of surrounding materials.

Ultrasonic welding

We specialize in ultrasonic welding for both internal clip or strap interconnections and external bus bar connections in high-current power modules. This process ensures robust, low-resistance joints with minimal thermal impact, making it ideal for sensitive electronic assemblies.
Critical to the success of ultrasonic welding are the precise selection of process parameters, the design and material of the sonotrode, and the choice between rotational or transitional welding modes. Each element plays a vital role in achieving consistent weld quality, mechanical strength, and long-term reliability.

Large-Area SINTERING for Power Modules on Cooling Units

Large-area sintering is a key process for mounting power modules directly onto cooling units, enabling exceptional thermal conductivity, mechanical stability, and long-term reliability. Using pressure-assisted sintering with silver (Ag) or copper (Cu) media, we achieve a uniform, void-free bond line across the entire module footprint—ensuring optimal heat dissipation and electrical performance.

One of the most critical reliability threats in this interface is delamination, which can lead to thermal runaway, mechanical failure, and premature module degradation. Delamination is a known reliability killer, especially under high thermal and power cycling conditions.

We master non-delamination techniques through advanced development methods, including optimized surface preparation, tailored sinter media selection, and controlled pressure profiles. These approaches are specifically designed to eliminate delamination risk and ensure robust adhesion throughout the module’s lifetime.

Material compatibility, thermal expansion matching, and sintering process control are essential to achieving a durable, high-performance interface. This solution is ideal for automotive, industrial, and renewable energy applications where thermal management and reliability are mission-critical.

Large-Area SOLDERING for Power Modules on Cooling Units

Large-area soldering is a critical technique for attaching power modules directly onto cooling units, enabling efficient thermal transfer, mechanical stability, and long-term electrical performance. By applying controlled soldering processes across the full module footprint, we ensure uniform wetting, minimal void formation, and consistent bond integrity.

One of the most significant threats to reliability in this interface is delamination, which can compromise thermal paths, induce mechanical stress, and lead to premature failure. Delamination is a known reliability killer—especially under thermal cycling and high-power operation.

We have deep expertise in non-delamination soldering techniques, using advanced surface preparation, optimized solder alloy selection, and precise thermal profiles to eliminate delamination risk. Our process ensures strong metallurgical bonding between the module and cooling substrate, even across large areas.
Key factors for success include:

• Solder alloy composition and melting behavior
• Surface finish and metallization compatibility
• Reflow profile control and pressure application
• Thermal expansion matching between module and cooler
• This solution is ideal for automotive, industrial, and renewable energy applications where thermal management and reliability are mission-critical.