We embed your Company in a
Research & Industry ecosystem designed to speed innovation and path to market.
Lynx Packaging Technologies brings over 30 years of proven excellence in power packaging R&D and manufacturing — a high-tech European company and trusted partner for complex, high-performance development projects.
From cost-efficient discrete packages to advanced sintered power modules, our expertise covers the full spectrum of packaging. We master cutting-edge processes for Silicon, SiC, and GaN devices — delivering end-to-end solution to our Customers.
Low-cost, reliable
packaging solutions
ON TIME.
Reduce or avoid overhead cost and
meet your project timeline.
Intellectual Property and Technological Innovation
Our IP delivers exceptional electrical and thermal performance while maintaining competitive costs.
Our solutions are designed to evolve alongside the technical demands of expanding sectors such as
e-mobility, artificial intelligence, and renewable energy.
Built-to-print Package Development
Development of custom packages based on customer specifications, regardless of economy of scale.
Enabling strategic independence
Full customer empowerment and involvement in Lynx packaging and ecosystem: BOM, Assembly & Testing Equipment suppliers, Research institutes, OSATs.
Advanced and Predictive Simulation Models
We are capable to develop highly sophisticated simulation models, built on thousands of real-world measurements and refined through over a decade of collaboration with partners.
Enhanced with AI, our models enable a precise mirroring of the actual physical behavior.
Global support
With presence in Europe, USA, Asia, we combine global reach with local responsiveness.
Our advanced technical capabilities, coupled with worldwide presence, reinforce our position as a trusted partner to global industry leaders.
Our locations
